Jenith
Well-known Member
- Joined
- Mar 25, 2019
- Posts
- 53,729
- Likes
- 242
Samsung is exploring new ways to push its in-house Exynos silicon forward, and early details suggest the next-generation Exynos 2700 could introduce a different approach to chip layout.
One of the more notable changes under consideration for the Exynos 2700 chip is an SBS, or Side-by-Side, architecture aimed at improving both thermals and performance.
SBS refers to a design where the RAM and SoC (system-on-chip) sit next to each other rather than being stacked. The current Exynos 2600 uses a stacked layout, placing memory directly on top of the SoC.
Moving these components side-by-side changes how heat is distributed and how data travels between them, opening the door to measurable gains.
One immediate advantage comes from shorter data paths. With RAM positioned closer in a lateral layout, signals have less distance to travel, which can translate into faster communication.
Early estimates point to a potential 30 to 40 percent increase in memory bandwidth for Samsung's next-gen Exynos 2700 chip.
Efficiency is also part of the equation. A side-by-side layout can reduce power demands tied to data transfer, helping the chip run cooler and consume less energy under load.
In addition, thermal management should see further gains thanks to Samsung’s HPB cooling solution, first introduced with the Exynos 2600. If the Exynos 2700 RAM and SoC are exposed more evenly, the HPB cooling system can dissipate heat even more effectively.
The Exynos 2600, which powers the Galaxy S26 and Galaxy S26+ in most regions, proved to be a surprisingly competent chip considering some of Samsung's previous attempts. Its progress raises expectations for the next-gen chip, and it makes sense for Samsung to want to build on this momentum.
It is still early, but the Exynos 2700 is expected to target premium devices launching in 2027, potentially powering the base and Plus Galaxy S27 models in select markets.
One of the more notable changes under consideration for the Exynos 2700 chip is an SBS, or Side-by-Side, architecture aimed at improving both thermals and performance.
SBS refers to a design where the RAM and SoC (system-on-chip) sit next to each other rather than being stacked. The current Exynos 2600 uses a stacked layout, placing memory directly on top of the SoC.
Moving these components side-by-side changes how heat is distributed and how data travels between them, opening the door to measurable gains.
Exynos 2700 and SBS: Less stacking, more breathing room
One immediate advantage comes from shorter data paths. With RAM positioned closer in a lateral layout, signals have less distance to travel, which can translate into faster communication.
Early estimates point to a potential 30 to 40 percent increase in memory bandwidth for Samsung's next-gen Exynos 2700 chip.
Efficiency is also part of the equation. A side-by-side layout can reduce power demands tied to data transfer, helping the chip run cooler and consume less energy under load.
In addition, thermal management should see further gains thanks to Samsung’s HPB cooling solution, first introduced with the Exynos 2600. If the Exynos 2700 RAM and SoC are exposed more evenly, the HPB cooling system can dissipate heat even more effectively.
The Exynos 2600, which powers the Galaxy S26 and Galaxy S26+ in most regions, proved to be a surprisingly competent chip considering some of Samsung's previous attempts. Its progress raises expectations for the next-gen chip, and it makes sense for Samsung to want to build on this momentum.
It is still early, but the Exynos 2700 is expected to target premium devices launching in 2027, potentially powering the base and Plus Galaxy S27 models in select markets.