Jenith
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Samsung has slowly but steadily improved Exynos chips. Gone are the days when Exynos processors overheated, causing phones to slow down and consumed significantly more power than rival chips. However, Exynos chips are still not considered the best, and Samsung may be taking a cost-cutting approach with the Exynos 2700 chip expected to power the Galaxy S27 series.
According to a report from SisaJournal, Samsung is considering dropping Fan-Out Wafer-Level Packaging (FOWLP) technology for the Exynos 2700.
FOWLP is an advanced semiconductor packaging technology that helps make chips faster, smaller, and thinner. It works by building electrical connections outside the die area of the chip, allowing more input/output pins within a smaller footprint compared to conventional packaging methods.
https://www.imeisource.com/wp-content/uploads/2025/12/Samsung-Exynos-2500-FOWLP.jpg
FOWLP structure – Source: Samsung
FOWLP was first used in Exynos 2400 in 2024 for the Galaxy S24 and the Galaxy S24+. While it improved heat management and performance, it also increased production costs and reduced chip yields because of added complexity. To improve profitability, Samsung is reportedly considering removing FOWLP from the Exynos 2700.
https://www.imeisource.com/wp-content/uploads/2025/12/Samsung-Exynos-2600-RAM-Heat-Path-Block-HPB.jpg
Exynos 2600 chip with Heat Path Block (HPB) technology – Source: Samsung
Samsung used another heat management technology called Heat Path Block (HPB) in the Samsung Exynos 2600. In this design, the HPB is placed on top of the processor beside the DRAM and storage components in a package-on-package (PoP) layout.
https://www.imeisource.com/wp-content/uploads/2026/05/Samsung-Exynos-2700-Side-By-Side-Expanded-Heat-Path-Block-Concept-Illustration.jpg
Layout of SbS Heat Path Block (HPB) heat dissipation mechanism – Source: @BairroGrande / X
The Exynos 2700 is rumored to use an even more advanced solution called Side-by-Side (SbS), which places a heat path block on both the processor and the DRAM chip, with both components positioned side by side on the same substrate. This design is intended to improve heat dissipation from both the processor and the RAM.
It remains to be seen how removing FOWLP and adopting the SbS design will affect the Exynos 2700âs performance, power efficiency, and thermal management.
The chip is reportedly being fabricated using Samsung Foundryâs second-generation 2nm process technology for improved efficiency.
Rumors also claim that it will feature a 10-core CPU, an AMD RDNA 5-based Xclipse 970 GPU, LPDDR6 DRAM, and UFS 5.0 storage support. It could be used in the Galaxy S27 and the Galaxy S27+ in markets outside of North America.
Exynos 2700 may lack FOWLP chip packaging technology
According to a report from SisaJournal, Samsung is considering dropping Fan-Out Wafer-Level Packaging (FOWLP) technology for the Exynos 2700.
What is FOWLP chip packaging?
FOWLP is an advanced semiconductor packaging technology that helps make chips faster, smaller, and thinner. It works by building electrical connections outside the die area of the chip, allowing more input/output pins within a smaller footprint compared to conventional packaging methods.
https://www.imeisource.com/wp-content/uploads/2025/12/Samsung-Exynos-2500-FOWLP.jpg
FOWLP structure – Source: Samsung
FOWLP was first used in Exynos 2400 in 2024 for the Galaxy S24 and the Galaxy S24+. While it improved heat management and performance, it also increased production costs and reduced chip yields because of added complexity. To improve profitability, Samsung is reportedly considering removing FOWLP from the Exynos 2700.
What is HPB used in Exynos 2600?
https://www.imeisource.com/wp-content/uploads/2025/12/Samsung-Exynos-2600-RAM-Heat-Path-Block-HPB.jpg
Exynos 2600 chip with Heat Path Block (HPB) technology – Source: Samsung
Samsung used another heat management technology called Heat Path Block (HPB) in the Samsung Exynos 2600. In this design, the HPB is placed on top of the processor beside the DRAM and storage components in a package-on-package (PoP) layout.
Exynos 2700 could use SbS heat dissipation technology
https://www.imeisource.com/wp-content/uploads/2026/05/Samsung-Exynos-2700-Side-By-Side-Expanded-Heat-Path-Block-Concept-Illustration.jpg
Layout of SbS Heat Path Block (HPB) heat dissipation mechanism – Source: @BairroGrande / X
The Exynos 2700 is rumored to use an even more advanced solution called Side-by-Side (SbS), which places a heat path block on both the processor and the DRAM chip, with both components positioned side by side on the same substrate. This design is intended to improve heat dissipation from both the processor and the RAM.
It remains to be seen how removing FOWLP and adopting the SbS design will affect the Exynos 2700âs performance, power efficiency, and thermal management.
Rumored Exynoso 2700 specifications
The chip is reportedly being fabricated using Samsung Foundryâs second-generation 2nm process technology for improved efficiency.
Rumors also claim that it will feature a 10-core CPU, an AMD RDNA 5-based Xclipse 970 GPU, LPDDR6 DRAM, and UFS 5.0 storage support. It could be used in the Galaxy S27 and the Galaxy S27+ in markets outside of North America.