Nokia Hardware / Software FAQ

[josher]

Nokia Hardware / Software FAQ

Part 1 of X

PHONE FUNCTIONS each component

Battery
Function as a source of electricity Flow / Voltage required to provide electric current to the Aircraft phone

Flexible
Its function is a connector between the terminal or device or component that is located on the plane phone

EEPROM
Main data storage area or a permanent factory data, and does not work with or the absence of electric current on the phone, because the power has withdrawn. While lying there on the IC AUDIO

Regulator IC
To set the voltage, so that can be arranged according to the needs of each relevant component, and also as control from IC Charging is controlled by the CPU.

IC CHARGE
Components that work otomat at the time of charging and it works only for the voltage Battry which is controlled by the CPU through IC Regulator

IC AUDIO
As a function of the voice signal processing incoming RF IC's, and be forwarded to the Speaker, to strengthen the sound vibrations that have been changed into vibration Mic electricity and forwarded to RF IC, run the command from the CPU and the IC, there are Audio PCM (Pulse Code Module) and EEPROM read function code that signals coming from the operator to adjust the IMEI Ponsel also store data that is permanent, such as: IMEI, Phone Code, Sec.Code

LCD (Display Liquit Cell)
This component is functioning as a tool yanga will display all the activities / activities of the Aircraft on the phone

Key Pad
This component is functioning as a tool that provides the data to the CPU to the process and will be sent to other components related to the Aircraft phone

Interface IC
Function as a data controller by the CPU for Vibrator, buzzer, lights and a switch in the automatic phone Aircraft​

 

[josher]

UEM Description​

In the UEM, there are several important roles as the Energy Management Ponsel. Unlike the Nokia DCT3, UEM is some combination of ASICs, such as: CCONT, COBBA, chaps and UI DRIVERS.


UEM stands for Universal Energy Management, in accordance with his name, UEM has several functions that are very complex, including:

Crystal oscillator (32 kHz)
Each system Ponsel akan Oscilator found that the small beat was able to 32KHz,. UEM that will provide voltage control and Crystal Oscilator to be next to the UPP.

32 kHz RC oscillator Startup
When the phone is in the Power-down, from the RF Processor Clock can not be given to UPP, so the phone can power-up needed for Logic System Clock to the UPP. Required for this purpose Sleep Clock generated by Crystal Oscilator 32 kHz.

Real time clock logic
Clock, Date, Alarm Clock Logic required given by Cristal Oscilator 32kHz.


Regulator Baseband & RF
UEM is given by the main battery voltage of 3.7 Volt (VBATT). UEM has role as distribution voltage / regulator to the system based on the needs of all the required voltage on each system.

Baseband Regulator:
- VCORE, the need for programming voltage around 1.0 - 1.8 Volt - 200mA to UPP (VCORE DSP & VCORE MCU)
- vana, to provide voltage of 2.8 Volt - 80mA analog system to function (Btemp, VCXO Temp)
- VIO, give tengan of 1.8 Volt - 150mA for Logic I / Os (Input / Output Logic: Level Shifter MMC, IR, IC & Flash SDRAM, Bluetooth, LCD,) and UEM Logic.
- VFLASH1, to provide primary voltage of 2.8 Volt - 70mA to IR, Bluetooth, LCD, LED drivers and voltage to the BSI.
- VFLASH2/VAUX, to provide voltage of 2.8 Volt - 40mA for FM Radio and other Accesories.
- VSIM, provide voltage of 1.8 - 3.0 Volt - 25mA for SIM Card

Regulator RF:
- VR1, to provide voltage of 4.75 Volt - 10 mA to the VCP
- VR2, provide voltage of 2.78 Volt - 100 mA to: VRF_TX, MODOUTP_G_TX, MODOUTM_G_TX, MODOUTP_P_TX, MODOUTM_P_TX,
- VR3, to provide voltage of 2.78 Volt - 20 mA to: VDIG, Clock Out VCTXO (Osc 26MHz)
- VR4, provide voltage of 2.78 Volt - 50 mA to: VRF_RX, VF_RX, VPAB_VLNA
- VR5, provide voltage of 2.78 Volt - 50 mA to VPLL, VLO, VPRE,
- VR6, provide voltage of 2.78 Volt - 50 mA to VRXBB
- VR7, to provide voltage of 2.78 Volt - 45 mA to: VCO,

Charging functions
Battery Ponsel charging process is controlled by UEM. UEM has been store inside Charging Control that serves as the battery charging process. Mobile phone will automatically disconnect from the current to the battery charger when the battery voltage has reached the maximum voltage Charger although still connected to the Mobile, Battery voltage if the voltage under the maximum flow from the charger will continue to be given to the Battery.

11-channel A / D converter (MCU controlled)
UEM stored in the 11Channels Analog to Digital Converter used for the bandgap reference and voltage reference, this section will measure the BSI, Btemp, Vcharge.
o Battery Voltage Measurement A / D Channel (Internal)
o Charger Voltage Measurement A / D Channel (Internal)
o Charger Current Measurement A / D Channel (External)
o Battery Temperature Measurement A / D Channel (External)
o Battery Size Measurement A / D Channel (External)
OLED Temperature measurement A / D Channel (External)

Interface FBUS and MBUS
FBUS & MBUS is used to transfer data from computer to mobile phones, such as the process (Flash Programming), File Manager, etc.. The data will then be signed in to UPP and Flash IC.
Security Logic (Watchdog)
Watchdog stored in the UEM, the first is used for controlling system power-on and power-down. The two blocks used for security and storage IMEI, IMEI Watchdog akan control that is in the ROM with the UEM IMEI stored in the IC Flash, if there is a difference between the IMEI in UEM IMEI and IMEI in Flash then do akan Watchdog Power-Down within 32mS.

FLASH memory for code IMEI
UEM is available in the ROM that is used to store data IMEI. Nature of data storage is IMEI OTP (One Time Programming) where IMEI data can be written only once and can not be removed or replaced, because the former UEM IMEI or ever written can not be used to Ponsel the other except when the IMEI is in the IC Flash can be equated with the IMEI that is on UEM (Calulate Flash), this material is described in Chapter akan Software.
When the ROM is in the UEM is problematic or Corupt then this is UEM can not be used again and can not be repaired again, will generally display the IMEI ????????? where the IMEI is on UEM IMEI is different from that it should even though there is only one number that is different.
IR interface level shifters
Used for the driver and the regulator Infra red, data is forwarded to the akn next UPP.

Interface LED, buzzer and vibrator
Vibrator, Keyboad LED, LED LCD is controlled by the Driver UI Subsystem resides in UEM. UI commands to the driver is provided by the UPP, UPP only give a very low voltage of the driver is required to provide adequate flow to the Vibrator, Keyboad LED, LED LCD.

Audio codec
Earphone, Microphone, IHF Speaker, Handsfree work because there is a subsystem Audio Codec stored on UEM. Subsystem is working to change the data signal into digital signal information Audio, so that the audio signal can be heard by human needs strengthening (Audio Amplyfier) before forwarded to the Speaker and Microphone, Audio signal has frequency of 20Hz to 20kHz.

SIM interface
SIM Card is the active components that have a microchip inside, each of the active components required supply voltage to him, voltage SIM card provided by the UEM's Baseband Subsystem Regulator of 1.8 Volt - 3Volt, while the SIM Clock, Reset SIM, SIM I / O data provided through the subsystem interface, which the store has the SIM Interface Detector SIM, SIM and SIM Driver IF IF.

Serial control interface (Cbus & Dbus Controled)
This section will control the use of the data transmission interface between the UEM and UPP are applied through CBUS and DBUS to MCU Subsystem stored in the UPP.

Auxiliary A / D converted (DSP controlled)
As a tool for bantu konfersi analog signal into digital signal that is used to control DSP Subsystem stored in the UPP, this section will play a role in: Digital Speech Processing and PDM Coded Audio.

RF interface converters
We have previously understood that the RF module has the analog signal while Baseband digital characters have, so that the second module is able to sustain one another, needed a conversion or translation signal into analog signal digital (A / D converter) and digital signal into analog signal ( D / A Converter). RF Interface Converter also called Multy Mode Converter which is a series between the RF module with UPP.

 

[josher]

UPP (Universal Phone Processor)​

UPP Description
Processor generation to the phone 4 (DCT4) using UPP (Universal Phone Processor) as the center of all activities computerization. Processor is the brain of the system of the mobile phone will make the coordination of all functions of the phone also includes instructions terprogram therein.​

Technology continues to develop Nokia DCT4, WD2 and Tiku is the development of technology DCT4. The difference is the type of Proccesor used and the internal memory capacity large enough. UPP-WD2 Tiku and can process data more quickly rather UPP DCT4, which can facilitate features a more sophisticated, such as Symbian operating system, access GPRS Class 10 (EDGE / BB4.5), Multy Task, TFT LCD, resolution until 2mega pixel camera, MMS, polyphonic Ringtone to 48channel, MP3 player, Bluetooth, external memory (MMC Support), etc..​

UPP Nokia DCT4, WD2 and Tiku basically have the same structure, which distinguishes only specification: ARM, DSP Core (LEAD3) and RAM cache stored in the UPP, of course RAM and ROM specifications stored in the UPP will also differ from one another. UPP has several functions, including:​

BRAIN
This section is the main brain of Microprocessor phone, this section has two functions:​

MCU Subsystem
Subsystem MCU (Micro Controller Unit) is processed by Microprocessor ARM (Advanced RISC Machines) and supported by: MCU ROM, RAM Cache, DMA (Direct Memory Access) memory and IF.​

DSP Subsystem
DSP Subsystem (Digital Signal Processing) block is processed by LEAD (Low power DSP Enhanced Architecture) is used to process Digital Application (A-DSP) and Digital Cellular (C-DSP). This section will set the data traffic information on the overall system of the phone.​

Brain Peripherals
This section will connect all the commands from the MCU and the DSP subsystem to the Body.​

Performance MCU and DSP subsystem is highly dependent of the cache RAM is stored in the UPP, Nokia WD2 Tiku and have the RAM cache is big enough, about 8-16Mbit. Cache RAM is a support unit. All commands that are frequently used by the UPP will be stored temporarily in this section. With the Cache RAM, UPP does not need to call the same to the other. Thus, the time needed to run the commands can be important, so that the speed of execution is better and faster.​

BODY
The entire system of all mobile phone controlled by Microprocessor. Body is part of the Microprocessor that act as the executor of the Brain. Body parts also function as a Digital Control Logic as follows:​

Function Description​

ACCIF
Interface to transfer data from aksesories: eg from infrared and cable Fbus / Mbus connecting to the computer to perform the data transfer from phone to computer.​

SIMIF
SIM Card Interface. Reading data from the sim card eg SIM ID, and storage of SMS Phone Book, etc..​

UIF
1. Interface audio signal to the earphone and microphone
2. As the LCD interface and Keyboard Interface
3. Codec also be used for the camera​

Pup
Used for data transfer software MCU and DSP external akan stored in external memory (Flash IC) Fbus connection or via Mbus. Suppose the phone in Flash, data from the computer that is connected to the phone Fbus akan received by Blok pup's Microprocessor ago Ponsel akan stored in the IC flash.​

CTSI
This section is used for Clock Management for: PURX, Clocking, timing, Sleep Clock, etc..
SCU
Control IF / RF module to RFbus. This section is used to control the frequency of routes that will be locked to the Base Station by RF Module (PLL).
MFI, GPRS CIP, RXModem​

The three blocks together is used to receive data and provide information to the RF module, but will be required before konfersi D / A - A / D. This section also determines the speed of data transfer, eg for access or GPRS can also be used as modem.​

UPP can work when you've given voltage of 1.5V is provided by the Regulator and VCORE Logic voltage (VIO) of 1.8 Volt dibeikan by the UEM. The initial booting process, UPP need of 32KHz Clock (Sleep Mode), while the main Clock provided by VCTCXO of RF Processor at 13MHz.​

 

[josher]

Memories (Flash \x26 RAM)

​

UPP will not be able to work full time when not assisted by the memory. As was discussed previously that the UPP has MCU and DSP subsystem therein. Akan subsystem but can not save the OS (Operating System) in their entirety, because the very limited data storage, the additional memory required to store DSP and MCU Software (Firmware). Memory needed by the UPP is: Flash Memory, EEPROM, RAM.

DCT4 Nokia on the mobile phone, Flash Memory and RAM are combined mencadi an IC, usually called "IC Combo Flash".

Flash Memory
Flash Memory is used for data storage software MCU (Micro Controlled Unit) Software and DSP (Digital Signal Processor) which is the OS (Operating System) on the phone is called the normal (Firmware), a Flash Memory plays an important role in the case of a mobile phone system. Language packs or language options (on a Nokia mobile phone called the PPM), which is stored in the Flash Memory, the Phones that do not have a choice of English can be added or upgraded in the (Re-Flash) using tools and special programs.

Data-data that are stored not only the operating system data only, there are also data content pack or User Data Area used to store data or programs by mobile phone users, including: Phone Book, SMS, Games, Applications, Wallpapers, Ringtones, Images , Movie, Dll. Flash Memory in this sector can be removed manually from the ponselnya.

EEPROM Nokia DCT4 has diemulasikan with Flash IC. EEPROM is used for storage of important data that have been set in the factory by phone, the data in the EEPROM are: Signal Value Tunning, IMEI / isn, SID, MIN, SP-Lock, Security Code, etc.. Therefore, when the phone is replaced IC Flashnya, akan necessary calculations IMEI Code, if not then the phone will not work.

The average capacity Nokia DCT4 have data on the Flash memory from 16Mbit to 64Mbit. While the Flash Memory on the phone WD2 akan require storage of data is very large, ranging from 128Mbit to 256Mbit, so WD2 Nokia will have 2 to 4 units Flash IC inside.

Flash Memory on Nokia mobile phones that use processor Tiku, use 2 separate IC Flash: First, NOR Flash, used to store primary data, disinilah MCU Software Security and IMEI is stored. The two NAND Flash, mostly used to store user data, such as Sounds, Games, Applications, and also keep the language packs.

RAM (Random Access Memory)​

As the temporary storage of data required RAM, Nokia DCT4 still use SRAM (Synchronous RAM) with a capacity of about 64Mbit which has been intergrasikan with Flash IC (Combo Flash), while for the Nokia WD2 and Tiku use SDRAM (Synchronous Dynamic RAM) that have the capacity data of 128-256Mbit separately from the Flash IC.

SRAM and SDRAM suplay voltage provided by UEM via VIO of 1.8 Volt.

 

[josher]

Introduction to ASICs
Application-Specific Integrated Circuit
​

ASIC is a continuation of application-specific integrated circuit. From the birth of VLSI (Very Large-Scale Integration), people began to realize the advantages of designing a customized IC than IC using standard stand-alone.
Made in the system is Mikroelektronik then defines the functions that can be implemented with standard IC and then to implement logic functions remaining with the custom IC.

After VLSI can be used, the system can be built from components in a small number of IC combined with a standard amount relative to the many custom IC that was a little more relative. Build a system with IC mikroelektronik fewer make more low-cost and high reliability.
After the Custom Integrated circuits Conference (CICC) first held by IEEE, a custom IC that is get a new name now that we as an ASIC.

Example IC ASIC is not a part such as memory chips that are sold to commodities such as ROM, SRAM, DRAM, microprocessor, TTL or TTL ekivalen with the level of SSI, MSI, and LSI.

IC is an example of ASIC including: chip for toys that can talk; chip for satellite; chip to interface between the microprocessor and memory on the CPU and the chip contains a microprocessor as the cells that share with the other logic.

ASIC can be divided into three types, namely full-custom IC, IC semicustom, and Programmable IC. Semicustom Programmable IC and IC can then be divided into several types. Semicustom IC can be divided into two types, namely standard-cell-based ASIC and gate-array-based ASIC. Programmable ASIC and is divided into Programmable logic devices and terbari in-the-field family ASIC-Programmable gate array.

Full-Custom ASIC
In full-custom ASIC designers will be designing a part or all of the logic cells, or a series of layout for a specific ASIC. This type is used only if there is no cell library that can be used to design a whole.

Standard-Cell-Based ASIC
Cell-based ASIC (cell-based IC, or CBIC, read: "sibik") using the cell logic perdesigned, (gate, AND, OR, multiplexer, flip-flop) which is known as standard cells. We can apply the CBIC on any IC that uses cells, but in general CBIC means standard-cell-based ASIC or standard cell based ASIC.

Gate-Array-Based ASIC
At the gate-array-based ASIC transistornya in predefine the silicon wafer. Predefine a pattern on the gate array is called the base array, and the smallest element *******ted to form the base array is called the base cell (sometimes called a primitive cell).

Gate-array-based ASIC itself divided into several types, namely Channeled gate arrays, Chanelles gate arrays, gate arrays and Structured

Channeled Gate Array
There are some important features on the type of MGA (Masked Gate Array, of a Gate-Array-Based ASIC) this. The first is the Channeled Gate-Array in the customized interconnect its course. Interconnect is the space between the rows of the base of predefined cell. The time needed for its manufacture is between 2 days to 2 weeks. Channeled gate array is similar to the CBIC, in the case that both the cell line by a separate channel that is used to interconnect. The difference is in the interconnect space for channeled gate array is fixed, while the CBIC can be arranged.

Channelles Gate Aray
Also known as channel-free gate array or sea-of-gates array (SOG array). Clear difference with channeled gate array is an array that SOG does not have this space between cells. So that inter-cell routing is done over the gate-array. This can be done because we set the contact layer which defines the relationship between the metal, the first layer on the metal, and the transistor.

Structured Gate Array
Is also embedded gate array. Gate array combines the features of CBIC and MGA. Excess on the CBIC combined with the advantages of MGA, the efesiensinya CBIC with low cost and quick turnaround of the property of MGA. Important features embedded in the gate array is a custom block it can be embedded.

Programmable Logic Device
Programmable logic that makes devices (PLD) is in the family is that ASIC PLD can be configured or deprogram part to create a customized on a specific application. In fact this is actually PLD IC standards are made in bulk. Important feature of PLD is as follows:
• No mask layers or logic cells that customized
• Design a fast turnaround
• A single block of the Programmable interconnect.
• A matrix macrocell contains logic that is usually Programmable logic array that connect with the flip-flop or latch

Field-Programmable Gate Array
This type of ASIC is the most up to date. The difference between the Field-Programmable Gate Array (FPGA) with the PLD that are usually only FPGA larger and more complex than PLD. In fact, usually referred to complex FPGA PLD.


Stage in the ASIC design is as follows:
1. Design entry: Starting ASIC design system with HDL (hardware description language) or with the schematic entry
2. Logic synthesis: Creating netlist, the description of the logic cell and connection
3. System particionisanje: Sharing the system becomes ebsar parts sized ASIC
4. Prelayout simulation: Checking whether the design works properly or not
5. Floorplanning: Set the block on the chip netlist
6. Placement: decide on the location of each cell block
7. Routing: Making connections between the cells and block
8. Extraction: Defining resistansi and kapasitansi of interconnection
9. Postlayout simulation: Checking to see if the design still works with the interconnect has been added.

Cell Library is the key to the design of ASIC. Each cell in the ASIC cell library must contain the following:

Physical Layout:
behavioral model
Verilog / VHDL model
Timing model details
Test strategy
Circuit schematic
Cell icon
Wire-load model
Routing model

For the FPGA, making the company the author is in the form of cell library design kit, so we have no choice, besides the price is also very very expensive. For MGA and CBIC, we have three options: ASIC vendor's library, the library purchased from third party suppliers, or build our own cell library.

 

[josher]

Once you know the hardware nokia BB5 following job step (Power ups Steps)

RAP3G
RAP3G is a Radio Application Processor
Tiku its success (in the NOKIA 7600) with some technical development and the addition of features
In general RAP3G consists of three parts:
-Prime (Main Processor), set the 3 functions, namely PH3, DSP and related
-MCU Peripherals
-DSPperipherals

RAP3G run with NOS and oversees all activities of the modem
RAP3G core voltage of 1.40V at start TAHVO
VCORE and VI / O (input / output) comes from the CORE RETU VIO.Power on sleepmode under 1.05V

RETU
ASIC is RETU EM major functions including the function block:
Start-up control logic and reset
Charging-deteck process
Battery-voltage Monitoring
-External 32.768kHz crystal clock with the
Real-time clock with external battery backup
SIM-Card interface
-Streo audio codecs and amplifiers
-A / D converter
-Regulator
Vibra-interface
-Digital interface (CBUS)
RETU ASIC does not have any function securyti the withdrawal UEM (E, K)

TAHVO
EM is TAHVO including ASIC function block:
CORE-supply generation (VCORE & VCOREA)
Level-shifter and regulator for USB / FBUS
Battery-control processes such as the charging
External LED-driver control interface
-Digital interface (CBUS)
-TAHVO ASIC does not have any security function of the withdrawal UEM (E, K)

CMT Flash
CMT Flash memory used to store:
-MCU program code
DSP-prgram code
-Tuning Values
-Certificates
Capacity-64Mbit
Logic-supply voltage and for NOR Flash in the output from the VIO (1.8V)
Flash Clock is 48Mhz (192Mhz / 4)

CMT SDRAM
CMT SDRAM is dinamic data storage for the MCU data
Capacity 64MBit
SDRAM core voltage (1.8v) output by the regulator RETU VDRAM
Voltage I / O (1.8) in the output by RETU VIO regulator
SDRAM clock is 96Mhz (192Mhz / 2)

OMAP
OMAP is an application of the system running with Symbian (EPOC)

Platform for ease of use application, the basic interface (Main Interface):
-Cameras
The screen -
-Bluetooth
MMC -
-USB
-Keyboard
XBUS-to medium with RAP3G
OMAP is a standard ASIC design by Texas Instrument and in use by the Vendor and other NOTEBOOK
VCORE CORE Voltage (1.4V generated by the discrete SMPS and work under 1.09V on sleepmode
I / O voltage VIO (1.8V) by RETU

APE COMBO MEMORY
APE flash used to store application code and user data
Lets not to access the code directly from Flash ---> loader must walk to and from DDR
256MBit capacity (flash), 256MBit (DDR)
DDR voltage to 1.8V is VDRAM
VIO is 1.8V of DDR I / O
Both NAND core voltage and I / O originating from RETU
Clock is 110Mhz DDR (220MHz / 2)
Flash interface speed is 22MHZ

Product Specific Circuitries
Front of the camera
in front of the camera control and data collection by the OMAP
OMAP's VIO voltage is 1.8V and one of them is 2.8V because of the level shifter need
Take the camera from two different voltage LDO (Low-Dropout Voltage)
VCAM 1.5V for a series of digital camera sensor and A / D-converter
VCAM2 2.8V for camera I / O and sensor photo diode

Camera back
Connected to the OMAP through data and control interface
Data on the differences SALURKAN through serial interface using the clock and data
Kontroli connect the camera directly to the control interface that kompatibble IC with 2% using the SCL SDA signal (1.8V)
Digital camera: discrete VCAM 1.5V from LDO
Analog camera: VAUX 2.5V from RETU
Additional control signal
Vctrl: High = 1.8V Camera active-low = 0V camera is not active
Extclk: CLOCK's OMAP1710 (9.6MHz)

Camera Flash Light
Designed to provide better lighting when taking pictures in dark room
The same LED also in use as an indicator light when a video is being taken
TK1189 is SMPS for FLED, in use as the two host controller
Flash in the control set by the camera
Mode indicator in the set by OMAP

Bluetooth
BTBC3 single chip (including RF, BB & ROM memory)
UART interface for control / data with the OMAP
PCM interface for audio data with RAP3G
I / O 1.8V from VIO
Analog voltage of 2.85V through battre discrete LDO
38.4MHz clock from the RF

Now you can understand this on written in technical terms.
After the phone power-up... what happens ..


After the power ON
Sleep the Clock RETU, vana, VIO, VR1 and VDRAM
RETU voltage on the pin RSTX akan TAHVO enable ASIC
TAHVO active VCORE (RAP3G) ascillator and internal control VCOREA (OMAP)
VCTCXO regulators work and RFCLK (38.4MHZ) controlling by the regulator RETU
RETU issue PURX after 16ms after RFClk stable
2.4 MHz clock for the SMPS output in TAHVO
PURX out and after running 2.4 clock synchronization is detected, control TAHVO akan VCOREA
System work and run
Software functions to set the other regulators